Supermicro X9DRW-3F Intel® C606 LGA 2011 (Socket R)

Supermicro X9DRW-3F Intel® C606 LGA 2011 (Socket R)

  • Brand: Supermicro
  • Category:
  • SKU: MBD-X9DRW-3F-B
  • EAN: 0672042106332
MBD-X9DRW-3F -B, Dual Socket R (LGA 2011), 16x 240-pin DDR3 DIMM sockets, Intel C606 chipset, 128Mb SPI Flash EEPROM with AMI BIOS

Trade Prices

Distributor Product SKU Stock Updated Price
Boston X9DRW-3F (Bulk) MBD-X9DRW-3F-B Register free see stock

Retail Prices

Merchant Product Condition Updated Price
Amazon New £125.49
Amazon New £92.35

Description

1. Dual socket R (LGA 2011) supports
Intel® Xeon® processor E5-2600
2. Intel® C606 chipset; QPI up to 8.0GT/s
3. Up to 512GB DDR3 1600MHz ECC
Registered DIMM; 16x DIMM sockets
4. Riser card support:
Left side - 1 (x32) PCI-E 3.0
5. Intel® i350 Dual port GbE LAN
6. 4x SATA2 and 2x SATA3 ports
7. 8x SAS ports from C606
8. Integrated IPMI 2.0 and KVM with
Dedicated LAN
9. 6x USB 2.0 ports
(4 rear and 2 via header)

Specifications

Technical details
Motherboard chipsetIntel® C606
Number of processors supported2
Number of DIMM slots16
Component forServer
Compliance certificatesRoHS
Performance
Motherboard chipsetIntel® C606
RAID levels1, 5, 10
Component forServer
Processor
Processor manufacturerIntel
Processor socketLGA 2011 (Socket R)
Supported QPI8 GT/s
Memory
Supported memory typesDDR3-SDRAM
Supported memory clock speeds800,1066,1333,1600 MHz
Maximum RDIMM memory512 GB
Maximum UDIMM memory128 GB
Storage controllers
Supported storage drive interfacesSATA II, SATA III
RAID levels1, 5, 10
Graphics
On-board graphics card modelMatrox G200
Internal I/O
Supported storage drive interfacesSATA II, SATA III
USB 2.0 connectors6
Rear panel I/O ports
USB 2.0 ports quantity6
VGA (D-Sub) ports quantity1
PS/2 ports quantity1
Ethernet LAN (RJ-45) ports2
IPMI LAN (RJ-45) portYes
Network
Ethernet LANYes
Ethernet interface typeGigabit Ethernet
Features
Motherboard chipsetIntel® C606
Component forServer
Expansion slots
PCI Express slots version3.0
BIOS
BIOS typeAMI
BIOS memory size128 Mbit
ACPI version4.0
Operational conditions
Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)8 - 90%
Weight & dimensions
Width305 mm
Depth330 mm
Other features
Maximum UDIMM memory128 GB
Number of processors supported2
Number of DIMM slots16
Supported DIMM module capacities16GB, 1GB, 2GB, 32GB, 4GB, 8GB