HPE Intel Xeon-Gold 5218R processor 2.1 GHz 27.5 MB L3

  • Brand: HPE
  • Category:
  • SKU: P24480-B21
  • EAN: 0190017437538 4549821349654
Intel Xeon-Gold 5218R (2.1GHz/20-core/125W) Processor Kit for ProLiant DL360 Gen10

Trade Prices

Distributor Product SKU Stock Updated Price
EET

DL360 Gen10 5218R Kit

P24480-B21 Register free see stock
Ingram Micro

INTEL XEON-G 5218R KIT FOR DL36

2M2SUT4
TD Synnex UK

Intel Xeon Gold 5218R - 2.1 GHz - 20-core - for Nimble Storage dHCI Small Solution with HPE ProLiant DL360 Gen10, ProLiant DL360 Gen10

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5669477
Westcoast

INTEL XEON-G 5218R KIT FOR DL360 GEN

P24480-B21
DSM Distribution

Intel Xeon Gold 5218R - 2.1 GHz - 20-core - for Nimble Storage dHCI Small Solution with HPE ProLiant DL360 Gen10; ProLiant DL360 Gen10

P24480-B21
Ingram Micro CS

INTEL XEON-G 5218R KIT FOR DL36

2M2SUT4
Memory Bank

INTEL XEON-G 5218R KIT FOR DL360 GEN

CLP24480-B21
SYNAXON

INTEL Xeon Gold 5218R / 2.1 GHz processor

STD10021214

Specifications

Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.1 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)125 W
Processor cache27.5 MB
Processor model5218R
Processor threads40
System bus rate10.4 GT/s
Processor operating modes64-bit
Processor boost frequency4 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel® Xeon® Gold
Processor cores20
BoxNo
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Memory
Maximum internal memory supported by processor1.02 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2667 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)125 W
Technical details
PCI Express slots version3.0
Scalability2S
Thermal Design Power (TDP)125 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)125 W
PCI Express slots version3.0
Scalability2S
Market segmentServer
Harmonized System (HS) code85423119
Logistics data
Harmonized System (HS) code85423119