Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
INTEL XEON 2.8GHZ/800 |
397645-B21 |
Retail Prices
| Merchant | Product | Condition | Updated | Price |
|---|---|---|---|---|
| Amazon | Used | £499.00 |
Description
Maximize Performance. Minimize Power. Automatically.
As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with standard enterprise servers that deliver more performance and scalability, more efficiently.
As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with standard enterprise servers that deliver more performance and scalability, more efficiently.
Specifications
| Processor | |
|---|---|
| Processor base frequency | 2.8 GHz |
| Thermal Design Power (TDP) | 110 W |
| Processor cache | 2 MB |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.25 - 1.4 V |
| FSB Parity | Yes |
| Component for | Server/workstation |
| Processor lithography | 90 nm |
| Processor family | Intel® Xeon® |
| Processor front side bus | 800 MHz |
| Processor cores | 1 |
| Processor socket | Socket 604 (mPGA604) |
| Processor cache type | L2 |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 110 W |
| VID Voltage Range | 1.25 - 1.4 V |
| Technical details | |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Number of Processing Die Transistors | 169 M |
| Processing Die size | 135 mm² |
| Thermal Design Power (TDP) | 110 W |
| Market segment | Server |
| Processor cache type | L2 |
| Features | |
| Thermal Design Power (TDP) | 110 W |
| Processor package size | 42.5 mm |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 169 M |
| Processing Die size | 135 mm² |
| Market segment | Server |
| Processor special features | |
| Enhanced Intel SpeedStep Technology | Yes |
| Operational conditions | |
| Tcase | 72 °C |
| Weight & dimensions | |
| Processor package size | 42.5 mm |
